Chee Lip Gan

发表

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts

Zhong Chen, Vinod K. Murugan, Zhigang Jia, 2016, Microelectron. Reliab..

Review on test vehicles for electromigration (EM) study in solder interconnects

Chee Lip Gan, Zhong Chen, Ze Zhu, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Copper micro and nano particles mixture for 3D interconnections application

Chee Lip Gan, Chuan Seng Tan, Yuan Yuan Dai, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics

Chee Lip Gan, Riko I. Made, F. L. Lau, 2013, Microelectron. Reliab..

Customized glass sealant for ceramic substrates for high temperature electronic application

Zhong Chen, Chee Lip Gan, Ahmed Sharif, 2014, Microelectron. Reliab..

Property study of TbFeCo for all-optical magnetic recording

Luping Shi, Chee Lip Gan, J. M. Li, 2010, Optical Data Storage.

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution

Zhong Chen, Chee Lip Gan, Bob Chylak, 2016, Microelectron. Reliab..

Comprehensive Laser Sensitivity Profiling and Data Register Bit-Flips for Cryptographic Fault Attacks in 65 Nm FPGA

Wei He, Shivam Bhasin, Chee Lip Gan, 2016, SPACE.

Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation

Govindo J. Syaranamual, Chee Lip Gan, Riko I. Made, 2016, Microelectron. Reliab..

Study of Ag-In solder as low temperature wafer bonding intermediate layer

Chengkuo Lee, John H. Lau, Chee Lip Gan, 2008, SPIE MOEMS-MEMS.

Electromigration reliability comparison of Cu and Al interconnects

Donald E. Troxel, Chee Lip Gan, Frank L. Wei, 2005, Sixth international symposium on quality electronic design (isqed'05).

Characterisation of defects generated during constant current InGaN-on-silicon LED operation

Yu Gao, Govindo J. Syaranamual, Chee Lip Gan, 2017, Microelectron. Reliab..

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

Chee Lip Gan, Jun Wei, Yong Chiang Ee, 2012, Microelectron. Reliab..

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Donald E. Troxel, Chee Lip Gan, Syed M. Alam, 2007, Microelectron. J..

Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation

Govindo J. Syaranamual, Chee Lip Gan, Riko I. Made, 2017, Microelectron. Reliab..

Automated Profiling Method for Laser Fault Injection in FPGAs

Wei He, Shivam Bhasin, Chee Lip Gan, 2019, Automated Methods in Cryptographic Fault Analysis.

Extensive Laser Fault Injection Profiling of 65 nm FPGA

Wei He, Shivam Bhasin, Chee Lip Gan, 2017, J. Hardw. Syst. Secur..

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Zhong Chen, Chee Lip Gan, Bob Chylak, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization

Chee Lip Gan, Philippe Perdu, Dean Lewis, 2011, Microelectron. Reliab..

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

Chee Lip Gan, F. X. Che, W. N. Putra, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

A flexible polyimide cable for implantable neural probe arrays

Minkyu Je, Chee Lip Gan, Sang-Hyun Lee, 2013 .

Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors

Yu Gao, Chee Lip Gan, Carl V. Thompson, 2018, Microelectron. Reliab..

Unsupervised learning for signal mapping in dynamic photon emission

Chee Lip Gan, Stéphane Binczak, Philippe Perdu, 2015, Microelectron. Reliab..

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Zhong Chen, Chee Lip Gan, Bob Chylak, 2014, Microelectron. Reliab..

Circuit level reliability analysis of Cu interconnects

Donald E. Troxel, Chee Lip Gan, Syed M. Alam, 2004, International Symposium on Signals, Circuits and Systems. Proceedings, SCS 2003. (Cat. No.03EX720).

Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop

Chee Lip Gan, Philippe Perdu, Kevin Sanchez, 2016, Microelectron. Reliab..

Bidirectional electromigration failure

Chee Lip Gan, Vassilios A. Chouliaras, Vincent M. Dwyer, 2013, Microelectron. Reliab..

Electronic Materials Research in Singapore

Chee Lip Gan, Pooi See Lee, Chee Ying Khoo, 2016 .

Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing

Govindo J. Syaranamual, Chee Lip Gan, Carl V. Thompson, 2015, 2015 IEEE International Reliability Physics Symposium.

Synthesis, characterization, and photoluminescence of β-Ga2O3 nanofibers

Tow Chong Chong, Chee Lip Gan, Minghui Hong, 2004, International Symposium on Laser Precision Microfabrication.

Impact of Non-blocking Vias on Electromigration and Circuit-level Reliability Assessments of Cu Interconnects

Donald E. Troxel, Chee Lip Gan, Syed M. Alam, 2004 .

Experimental characterization and modeling of the contact resistance of Cu–Cu bonded interconnects

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2009 .

Effect of direct current stressing to Cu-Cu bond interface imperfection for three dimensional integrated circuits

Chee Lip Gan, Chuan Seng Tan, Riko I Made, 2013 .

Synthesis of hexagonal close-packed gold nanostructures.

Chee Lip Gan, Chad A Mirkin, Hua Zhang, 2011, Nature communications.

Adhesion Studies of Ta ∕ Low-k (Black Diamond) Interface using Thermocompressive Wafer Bonding and Four-Point Bend

Chee Lip Gan, Narayanan Balasubramanian, Dim-Lee Kwong, 2006 .

Effects of side reservoirs on the electromigration lifetime of copper interconnects

Chee Lip Gan, Yeow Kheng Lim, Juan Boon Tan, 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2004 .

Transient liquid phase Ag-based solder technology for high-temperature packaging applications

Chee Lip Gan, Zhong Chen, Ahmed Sharif, 2014 .

Self-organization of a hybrid nanostructure consisting of a nanoneedle and nanodot.

Chee Lip Gan, Ying Wang, Rajdeep Singh Rawat, 2012, Small.

A hybrid nanostructure array for gas sensing with ultralow field ionization voltage.

Chee Lip Gan, Yizhong Huang, Hai Liu, 2013, Nanotechnology.

Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing

Chee Lip Gan, Riko I. Made, Carl V. Thompson, 2016 .

Pulsed laser ablation of preferentially orientated ZnO:Co diluted magnetic semiconducting thin films on Si substrates

Chee Lip Gan, Yani Zhang, Thirumany Sritharan, 2006 .

Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

Chee Lip Gan, Chuan Seng Tan, Riko I Made, 2011, 2011 IEEE International Interconnect Technology Conference.

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Chengkuo Lee, John H. Lau, Chee Lip Gan, 2009 .

Length Effects on the Reliability of Dual-Damascene Cu Interconnects

Chee Lip Gan, Stefan P. Hau-Riege, Kin Leong Pey, 2002 .

Effect of Ta migration from sidewall barrier on leakage current in Cu/SiOCH low-k dielectrics

Chee Lip Gan, A. Y. Du, C. K. Cheng, 2009 .

Electromigration resistance in a short three-contact interconnect tree

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2006 .

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Lei Yao, Minkyu Je, Peng Li, 2013 .

The effect of stress migration on electromigration in dual damascene copper interconnects

Chee Lip Gan, Nagarajan Raghavan, Kin Leong Pey, 2011 .

Electromigration-induced extrusion failures in Cu/low-k interconnects

Christine Hau-Riege, Chee Lip Gan, Joost J. Vlassak, 2008 .

Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2001 .

Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2003 .

Joule heating-assisted electromigration failure mechanisms for dual damascene Cu/SiO/sub 2/ interconnects

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2003, Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003.

Effect of palladium on the mechanical properties of Cu–Al intermetallic compounds

Chee Lip Gan, Zhong Chen, Lu Shen, 2015 .

Application of contact theory to metal-metal bonding of silicon wafers

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2007 .

Self-aligned metal capping layers for copper interconnects using electroless plating

Chee Lip Gan, Jeffrey P. Gambino, M. Hernandez, 2006 .

Dielectric degradation mechanism for copper interconnects capped with CoWP

Chee Lip Gan, Jeffrey P. Gambino, J. Gambino, 2008 .