R. P. Kraft

Inline troubleshooting for electronics manufacturing systems

Ismail Fidan, R. P. Kraft, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

Ultrasonic imaging using trapped energy mode Fresnel lens transducers

R. P. Kraft, J. McDonald, H. Tiersten, 1980 .

Stacked chip-to-chip interconnections using wafer bonding technology with dielectric bonding glues

Russell P. Kraft, Jian-Qiang Lu, Ronald J. Gutmann, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration

Aamir Zia, Philip Jacob, Jin Woo Kim, 2010, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

R. P. Kraft, J. McDonald, T. Cale, 2001 .

Accurate high-speed performance prediction for full differential current-mode logic: the effect of dielectric anisotropy

Russell P. Kraft, John F. McDonald, R. B. Iverson, 1999, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU

Philip Jacob, Russell P. Kraft, John F. McDonald, 2015, IEEE Access.