Khadim Dieng

Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network

Yann Lamy, Thierry Lacrevaz, Bernard Flechet, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer

Thierry Lacrevaz, Alexis Farcy, Cédric Bermond, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations

Yann Lamy, Thierry Lacrevaz, Alexis Farcy, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results

Yann Lamy, Thierry Lacrevaz, Bernard Flechet, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.