Cedric Bermond

Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network

Yann Lamy, Thierry Lacrevaz, Bernard Flechet, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Some Strategic Tracks to Optimize Routing of High Speed Signal Transmission Between Memory and Logic in 3D-IC Stacks

C. Ferrandon, Thierry Lacrevaz, Bernard Flechet, 2013 .

Wide-band simulations of differential 3D interconnect propagation performances in a photonic interposer

Thierry Lacrevaz, Bernard Flechet, Alexis Farcy, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).