Sylvain Joblot

Through Silicon Capacitors (TSC) for noise reduction in Power Distribution Network

Yann Lamy, Thierry Lacrevaz, Bernard Flechet, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Method for the realization of a capability

Olivier Guiller, Sylvain Joblot, Yann Lamy, 2012 .

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer

Thierry Lacrevaz, Alexis Farcy, Cédric Bermond, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations

Yann Lamy, Thierry Lacrevaz, Alexis Farcy, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

A silicon platform with Through-silicon vias for heterogeneous RF 3D modules

Perceval Coudrain, Bruno Reig, Pierre Bar, 2011, 2011 6th European Microwave Integrated Circuit Conference.

Copper pillar interconnect capability for mmwave applications in 3D integration technology

Yann Lamy, C. Ferrandon, H. Sibuet, 2013 .

AlGaN/GaN HEMTs on (001) Silicon Substrate With Power Density Performance of 2.9 W/mm at 10 GHz

Christophe Gaquiere, Ali Soltani, Fabrice Semond, 2010, IEEE Transactions on Electron Devices.

Indirect ToF Pixel integrating fast buried-channel transfer gates and gradual epitaxy , and enabling CDS

Guo-Neng Lu, Sylvain Joblot, Auguste Ngoua, 2017 .