Pat Hester

Effect of wafer-scale shape variations and mounting in wafer bonding

Jaydeep K. Sinha, K. T. Tumer, S. M. Spearing, 2005 .

Nanotopography effects on chemical mechanical polishing for shallow trench isolation

Duane S. Boning, Noel Poduje, Brian Lee, 2000, 2000 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 2000 (Cat. No.00CH37072).

Wafer Nanotopography Effects on CMP: Experimental Validation of Modeling Methods

Duane S. Boning, John Francis Valley, Noel Poduje, 2001 .