Chukwudi A. Okoro

发表

Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses | NIST

Yaw S. Obeng, Joseph J. Kopanski, Lin You, 2014 .

Measurement Science for "More-Than-Moore" Technology Reliability Assessments

Pavel Kabos, Yaw S. Obeng, Joseph J. Kopanski, 2013 .

Broadband Microwave-Based Metrology Platform Development: Demonstration of In-Situ Failure Mode Diagnostic Capabilities for Integrated Circuit Reliability Analyses

Rhonda R. Franklin, Yaw S. Obeng, Joseph J. Kopanski, 2015 .

Metrology for Nanosystems and Nanoelectronics Reliability Assessments | NIST

Yaw S. Obeng, Joseph J. Kopanski, Chukwudi A. Okoro, 2012 .

Microstructural Investigation of Pulse Electroplated Copper Trenches Deposited with Organic Additives

Kathleen Richardson, Yaw S. Obeng, Chukwudi A. Okoro, 2016 .

(Invited) Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses

Yaw S. Obeng, Joseph J. Kopanski, Lin You, 2014 .

Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration

Bart Vandevelde, Eric Beyne, Cedric Huyghebaert, 2010 .

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, 2011 .