D. K. Sadana

Advanced flexible CMOS integrated circuits on plastic enabled by controlled spalling technology

M. Gaynes, A. Khakifirooz, D. Shahrjerdi, 2012, 2012 International Electron Devices Meeting.

Status of 300 mm SOI material: Comparisons with 200 mm

Richard J. Murphy, D. K. Sadana, Harold J. Hovel, 2003 .

Self-aligned III-V MOSFETs: Towards a CMOS compatible and manufacturable technology solution

E. Leobandung, D. K. Sadana, Y. Zhu, 2013, 2013 IEEE International Electron Devices Meeting.

CMOS-on-SOI ESD protection networks☆

Ghavam G. Shahidi, Steven H. Voldman, Bomy A. Chen, 1998 .

Challenges and opportunities of extremely thin SOI (ETSOI) CMOS technology for future low power and general purpose system-on-chip applications

B. Jagannathan, N. Loubet, P. Kulkarni, 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application.

Device and circuit design issues in SOI technology

Werner A. Rausch, F. Assaderaghi, Ghavam G. Shahidi, 1999, Proceedings of the IEEE 1999 Custom Integrated Circuits Conference (Cat. No.99CH36327).

Extremely thin SOI (ETSOI) technology: Past, present, and future

P. Kulkarni, H. Bu, A. Khakifirooz, 2010, 2010 IEEE International SOI Conference (SOI).