Ole Hoelck
发表
Steve Voges,
Tanja Braun,
Karl-Friedrich Becker,
2019,
Micromachines.
Klaus-Dieter Lang,
R. Aschenbrenner,
Steve Voges,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Klaus-Dieter Lang,
R. Aschenbrenner,
Steve Voges,
2018,
2018 International Wafer Level Packaging Conference (IWLPC).
Ha-Duong Ngo,
Biswajit Mukhopadhyay,
Oswin Ehrmann,
2016,
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).