R. Wenzel

The Redistributed Chip Package: A Breakthrough for Advanced Packaging

B. Keser, C. Amrine, Trung Duong, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Implementation of a mobile phone module with redistributed chip packaging

B. Keser, C. Amrine, Trung Duong, 2008, 2008 58th Electronic Components and Technology Conference.

Advanced Packaging: The Redistributed Chip Package

B. Keser, C. Amrine, Trung Duong, 2007, IEEE Transactions on Advanced Packaging.