S. Jin

发表

Microstructure and mechanical properties of indium–bismuth alloys for low melting-temperature solder

H. Nishikawa, Min-Su Kim, Sanghun Jin, 2018, Journal of Materials Science: Materials in Electronics.

Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping

Sungho Jin, H. Chen, M. Mccormack, 1997 .

Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

Min-Su Kim, Hiroshi Nishikawa, Shutetsu Kanayama, 2018, Microelectron. Reliab..

Effects of In Content on the Microstructure and Mechanical Properties of In–Bi Alloys During Isothermal Aging

H. Nishikawa, O. Mokhtari, Sanghun Jin, 2019, Metals.

Effect of indium on deformation of binary In-Bi alloys

H. Nishikawa, Min-Su Kim, S. Jin, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).