Shutetsu Kanayama

Microstructure and mechanical properties of indium–bismuth alloys for low melting-temperature solder

H. Nishikawa, Min-Su Kim, Sanghun Jin, 2018, Journal of Materials Science: Materials in Electronics.

Shear properties of In-Bi alloy joints with Cu substrates during thermal aging

Min-Su Kim, Hiroshi Nishikawa, Shutetsu Kanayama, 2018, Microelectron. Reliab..

Area: 6 Advanced Concepts and New Emerging Materials for Future PV. NOVEL MICRO CPV MODULE INTEGRATED WITH PLASTIC LENS, CIRCUIT BOARD AND III-V COMPOUND SEMICONDUCTOR UTILIZING INJECTION MOLDING AND SURFACE MOUNTING

Y. Aya, H. Nishitani, Shutetsu Kanayama, 2017 .

The Development of Cu Filling and Reliability Performance with Ru-Ta Alloy Barrier for Cu Interconnects

H. Korogi, N. Torazawa, S. Matsumoto, 2016 .

Effects of In Content on the Microstructure and Mechanical Properties of In–Bi Alloys During Isothermal Aging

H. Nishikawa, O. Mokhtari, Sanghun Jin, 2019, Metals.

Effect of indium on deformation of binary In-Bi alloys

H. Nishikawa, Min-Su Kim, S. Jin, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Alignment Tolerance Control of the Micro CPV Array Using Monte Carlo Methods

Kenji Araki, Nobuhiko Hayashi, Kan-Hua Lee, 2019, 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC).

Design of the Micro-Köhler Concentrator Optics for CPV Application

Kenji Araki, Nobuhiko Hayashi, Kan-Hua Lee, 2019, 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC).