Fei Shen

Effects of Isothermal Aging on Interfacial Microstructure and Shear Properties of Sn-4.5Sb-3.5Bi-0.1Ag Soldering with ENIG and ENEPIG Substrates

Z. Peng, Zhimin Liang, D. Wang, 2021, Metals.

Effect of Co-Addition of Ag and Cu on Mechanical Properties of Sn–5Sb Lead-Free Solder

Zhimin Liang, D. Wang, Liwei Wang, 2021, Transactions of the Indian Institute of Metals.

Effect of Ag and Cu co-addition on the microstructure evolution, interface behavior and mechanical properties of Sn-5Sb based solder joints subjected to different thermal aging conditions

Zhimin Liang, Xiao Yang, Yu Zhang, 2022, Microelectronics Reliability.