J. Li

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2014, Journal of Electronic Materials.

Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795

C. M. Johnson, P. Agyakwa, J. Li, 2016 .

Response to comments on “ A numerical method to determine interdiffusion coefficients of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds ”

C. M. Johnson, P. Agyakwa, J. Li, 2016 .

Reliable Integration of Double-Sided Cooled Stacked Power Switches based on 70 micrometer Thin IGBTs and Diodes

J. F. Li, A. Castellazzi, A. Solomon, 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).