Wei-Cheng Wu

13.5 A 16nm 128Mb SRAM in high-κ metal-gate FinFET technology with write-assist circuitry for low-VMIN applications

Sreedhar Natarajan, Shien-Yang Wu, Hung-Jen Liao, 2014, 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC).

Glass additive influence on the sintering behavior, microstructure and microwave magnetic properties of Cu–Bi–Zn co-doped Co2Z ferrites

H. Hsiang, F. Yen, C. Hsi, 2011 .

60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects

C. Karnfelt, H. Zirath, Li-Han Hsu, 2007, IEEE Microwave and Wireless Components Letters.

Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

Wei-Cheng Wu, Yin-Chu Hu, Chin-Te Wang, 2014, IEEE Microwave and Wireless Components Letters.

A 16 nm 128 Mb SRAM in High- $\kappa$ Metal-Gate FinFET Technology With Write-Assist Circuitry for Low-VMIN Applications

Jonathan Chang, Shien-Yang Wu, Hung-Jen Liao, 2014, IEEE Journal of Solid-State Circuits.

A $\delta$-Doped InGaP/InGaAs pHEMT With Different Doping Profiles for Device-Linearity Improvement

Chun-Yen Chang, H. Yamaguchi, Yueh-Chin Lin, 2007, IEEE Transactions on Electron Devices.

A 130 mV SRAM With Expanded Write and Read Margins for Subthreshold Applications

Meng-Fan Chang, Po-Wei Chou, Wei-Cheng Wu, 2011, IEEE Journal of Solid-State Circuits.

A 64-Kb 0.37V 28nm 10T-SRAM with mixed-Vth read-port and boosted WL scheme for IoT applications

Hidehiro Fujiwara, Jonathan Chang, Hung-Jen Liao, 2016, 2016 IEEE Asian Solid-State Circuits Conference (A-SSCC).

SPDT GaAs Switches With Copper Metallized Interconnects

S.H. Chen, C.Y. Chang, S. H. Chen, 2007, IEEE Microwave and Wireless Components Letters.