Cheng-liang Cho

Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits

S. Lin, H. Chang, Cheng liang Cho, 2015, Electronic Materials Letters.

Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples

S. Lin, H. Chang, Cheng-liang Cho, 2013, Journal of Electronic Materials.