B. Nandagopal

发表

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

B. Nandagopal, T. Bieler, Hairong Jiang, 2008, IEEE Transactions on Components and Packaging Technologies.

Reliability modeling of chip scale packages

James M. Pitarresi, A. Primavera, S. Sethuraman, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).