G. Murakami

Effect of package structure on the residual stress of silicon chips encapsulated in IC plastic packages.

H. Miura, A. Nishimura, S. Kawai, 1990 .

Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling

A. Nishimura, S. Kawai, G. Murakami, 1989, Proceedings., 39th Electronic Components Conference.

A Stress Singularity Parameter Approach for Evaluating Adhesive Strength

Toshio Hattori, Toshio Hatsuda, Sohji Sakata, 1988 .

A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices

T. Hattori, G. Murakami, S. Sakata, 1989 .

Resistance Spot Welding Of Magnesium Alloy Sheets with Cover Plates

S. Satonaka, C. Iwamoto, G. Murakami, 2012, Welding in the World.

Structural effect of IC plastic package on residual stress in silicon chips

H. Miura, A. Nishimura, Sueo Kawai, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Improvement of moisture resistance in plastic encapsulated MOS-IC by surface finishing copper leadframe

Norio Okabe, Osamu Yoshioka, S. Nagayama, 1989, Proceedings., 39th Electronic Components Conference.