Y. Hirata

Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

H. Nishikawa, Chih-han Yang, S. Lin, 2021 .

Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging

H. Nishikawa, Chih-han Yang, S. Lin, 2022, JOM.

High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1

H. Nishikawa, Chih-han Yang, S. Lin, 2022, Science and Technology of Welding and Joining.

Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders

H. Nishikawa, Chih-han Yang, S. Lin, 2022, 2022 International Conference on Electronics Packaging (ICEP).

Visualization of Procollagen IV Reveals ER-to-Golgi Transport by ERGIC-independent Carriers

I. Wada, N. Hosokawa, Y. Hirata, 2020, Cell structure and function.

How to enhance Sn-Bi low-temperature solder by alloying?

H. Nishikawa, Chih-han Yang, S. Lin, 2023, International Conference on Electronics Packaging.