R. Schetty

Pb-free external lead finishes for electronic components: Tin-bismuth and tin-silver

R. Schetty, 1998, 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).

Minimization of tin whisker formation for lead‐free electronics finishing

R. Schetty, 2001 .

Optimization of damascene feature fill for copper electroplating process

E. Broadbent, J. Reid, V. Bhaskaran, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Electrodeposited tin properties & their effect on component finish reliability

R. Schetty, 2004, Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809).