H. K. Kannojia

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

P. Dixit, H. K. Kannojia, 2021, Journal of Materials Science: Materials in Electronics.

Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks

P. Dixit, H. K. Kannojia, 2019 .

Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate

P. Dixit, Shalabh Gupta, Ambika Shanker Shukla, 2021, Microsystem Technologies.

Through-substrate vias based three-dimensional interconnection technology

K. Henttinen, P. Dixit, H. K. Kannojia, 2020 .

Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM

P. Dixit, J. Arab, H. K. Kannojia, 2019, Precision Engineering.

Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining

P. Dixit, J. Arab, Ritesh Kumar, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding

P. Dixit, H. K. Kannojia, 2019, Journal of Materials Science: Materials in Electronics.

Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography

R. Shukla, A. Sinha, D. Pandey, 2020, ISSS Journal of Micro and Smart Systems.

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

D. K. Mishra, P. Dixit, J. Arab, 2019, Journal of Materials Processing Technology.