Xianghong Cui

发表

Investigation on elevated-temperature wear performance and wear failure mechanism of a tungsten-system hot-working die steel

Shaowei Cui, Lei Chen, Wei Jiang, 2022, Surface Topography: Metrology and Properties.

A study of the residual stress behavior of rigid and flexible epoxy adhesives during thermal cycle aging for electronics packaging

C. Qu, Changwei Liu, Xupeng Fan, 2023, Journal of Adhesion Science and Technology.