E. Liniger

Multilevel integration of patternable low-κ material into advanced Cu BEOL

Qinghuang Lin, S. T. Chen, A. Nelson, 2010, Advanced Lithography.

The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics

E. Liniger, S. Cohen, J. R. Lloyd, 2006, Microelectron. Reliab..

Reliability Challenges with Ultra-Low k Interlevel Dielectrics

R. Rosenberg, E. Liniger, J. R. Lloyd, 2004, Microelectron. Reliab..

Time dependent dielectric breakdown in a low-k interlevel dielectric

E. Liniger, S. T. Chen, J. R. Lloyd, 2004, Microelectron. Reliab..

Extending photo-patternable low-κ concept to 193nm lithography and e-beam lithography

Qinghuang Lin, A. Nelson, P. Brock, 2011, Advanced Lithography.