Y. Tadaki

Multi-storied photodiode CMOS image sensor for multiband imaging with 3D technology

Y. Gomi, Y. Takemoto, K. Kobayashi, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, 2015 .

Low temperature metal-based cell integration technology for gigabit and embedded DRAMs

Y. Tadaki, N. Ohashi, T. Umezawa, 1997, International Electron Devices Meeting. IEDM Technical Digest.

A 255 Mb SDRAM with subthreshold leakage current suppression

S. Miyatake, Y. Nakagome, K. Kajigaya, 1998, 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC. First Edition (Cat. No.98CH36156).

A 29 ns 64 Mb DRAM with hierarchical array architecture

T. Takahashi, M. Morino, K. Komatsuzaki, 1995, Proceedings ISSCC '95 - International Solid-State Circuits Conference.