W. E. Pence

Multilevel monolithic inductors in silicon technology

Keith A. Jenkins, Mehmet Soyuer, Joachim N. Burghartz, 1995 .

Packaging for wireless communications

W. E. Pence, 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

The Fundamental Limits for Electronic Packaging and Systems

W. E. Pence, J. Krusius, 1987 .

Analysis of materials and structure tradeoffs in thin and thick film multi-chip packages

J. P. Krusius, W. E. Pence, 1989, Proceedings., 39th Electronic Components Conference.

Signal propagation over perforated reference planes in stripline interconnect structures

J. L. Prince, R. Senthinathan, W. E. Pence, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Technology directions for portable computers

S. W. Depp, Scott Kirkpatrick, W. E. Pence, 1995, Proc. IEEE.

A 2.4-GHz silicon bipolar oscillator with integrated resonator

Keith A. Jenkins, Herschel A. Ainspan, Mehmet Soyuer, 1996 .

Package thermal resistance: geometrical effects in conventional and hybrid packages

J. P. Krusius, W. E. Pence, 1990 .

New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization

R. Subrahmanyan, J. P. Krusius, W. E. Pence, 1989, Proceedings., 39th Electronic Components Conference.

Potential of low temperature CMOS with normal and superconductive interconnect

W. E. Pence, J. Krusius, 1989, Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference.