Guillaume Parry

Refined dual-phase steel from cold-rolled martensite with 3.5wt% Mn.

Thomas Pardoen, Yves Bréchet, Olivier Bouaziz, 2014 .

Shape optimization by the level-set method applied to architectured flexural panels, in High Performance Structures and Materials V

Olivier Bouaziz, Guillaume Parry, L. Laszczyk, 2010 .

Influence of the martensite properties on the mechanical behavior of ferrite-martensite dual-phasesteels.

Thomas Pardoen, Yves Bréchet, Olivier Bouaziz, 2014 .

Chip to wafer copper direct bonding electrical characterization and thermal cycling

Stéphane Moreau, Léa Di Cioccio, Thomas Signamarcheix, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Thermomechanical finite element modeling of Cu–SiO 2 direct hybrid bonding with a dishing effect on Cu surfaces

Perceval Coudrain, Rafael Estevez, Guillaume Parry, 2016 .

Potential-based and non-potential-based cohesive zone formulations under mixed-mode separation and over-closure. Part I: Theoretical analysis

Guillaume Parry, Glenn E. Beltz, P. McGarry, 2014 .

Damage and fracture of dual-phase steels: Influence of martensite volume fraction

Thomas Pardoen, Olivier Bouaziz, Qingquan Lai, 2015 .

Design of Architectured Sandwich Core Materials using Topological Optimization Methods

Olivier Bouaziz, Guillaume Parry, Rémy Dendievel, 2009 .

Influence of martensite volume fraction and hardness on the plastic behavior of dual-phase steels: Experiments and micromechanical modeling

Thomas Pardoen, Olivier Bouaziz, Qingquan Lai, 2016 .

Snapthrough occurring in the postbuckling of thin films

Frédéric Foucher, Guillaume Parry, Alain Cimetière, 2005 .

Numerical and experimental investigations on the hybrid bonding of Cu/SiÜ2 patterned surfaces using a cohesive model

Sandrine Lhostis, Rafael Estevez, Vincent Fiori, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Mechanical resistance of patterned BCB bonded joints for MEMS packaging

F. Parrain, Guillaume Parry, Muriel Braccini, 2013 .

Potential-based and non-potential-based cohesive zone formulations under mixed-mode separation and over-closure-Part II: Finite element applications

Guillaume Parry, Glenn E. Beltz, P. McGarry, 2014 .