S. Groothuis

Packaging effect on reliability of Cu/low k interconnects

Guotao Wang, P.S. Ho, S. Groothuis, 2004, 2004 IEEE Workshop on Microelectronics and Electron Devices.

Investigation of residual stress in wafer level interconnect structures induced by wafer processing

S. Groothuis, P. Ho, S. Groothuis, 2006, 56th Electronic Components and Technology Conference 2006.

Parametric Investigation of Dynamic Behavior of FBGA Solder Joints in Board-Level Drop Simulation

S. Groothuis, Changming Chen, R. Kovacevic, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

Paul S. Ho, S. Groothuis, P. Ho, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..