T. Enot

3D Integration challenges today from technological toolbox to industrial prototypes

T. Magis, C. Laviron, A. Charpentier, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

A novel electrostatic actuator for micro deformable mirrors: fabrication and test

L. Jocou, J.C. Barbe, J. Margail, 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

Electronic-photonic integration in the helios project

J. M. Fedeli, E. Augendre, L. Zimmermann, 2013, 10th International Conference on Group IV Photonics.

Electrostatically actuated micro-fluidic optical cross-connect switch

J. Margail, T. Enot, Y. Gobil, 2003, 2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682).

Through silicon vias technology for CMOS image sensors packaging

X. Baillin, C. Brunet-Manquat, N. Sillon, 2008, 2008 58th Electronic Components and Technology Conference.

Next generation image sensor via direct hybrid bonding

L. Di Cioccio, S. Chevobbe, P. Coudrain, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

1/spl times/8 micro-mechanical switches based on moving waveguides for optical fiber network switching

J. Margail, P. Mottier, T. Enot, 2000, 2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399).

Three dimensional chip stacking using a wafer-to-wafer integration

N. Kernevez, M. Zussy, Zhihong Huang, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Challenges for 3D IC integration: bonding quality and thermal management

N. Kernevez, M. Zussy, F. de Crecy, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration

Roberto Guerrieri, M. Zussy, Roberto Canegallo, 2006 .