Chrystelle Lagahe-Blanchard

Direct wafer bonding & thinning down a generic technology to perform new structures

Bernard Aspar, Hubert Moriceau, Chrystelle Lagahe-Blanchard, 2005 .

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration

Léa Di Cioccio, Mariam Sadaka, Ionut Radu, 2013, Proceedings of 2013 International Conference on IC Design & Technology (ICICDT).

III-V/Si photonics by die-to-wafer bonding

Philippe Regreny, Gunther Roelkens, Roel Baets, 2007 .

Recent results on advanced molecular wafer bonding technology for 3D integration on silicon

Maud Vinet, N. Kernevez, Philippe Regreny, 2005 .