C. Schaeffer

Power MOSFET switching waveforms: an empirical model based on a physical analysis of charge locations

G. Verneau, Y. Avenas, L. Aubard, 2002, 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289).

On the use of flat heat pipes as thermal spreaders in power electronics cooling

C. Schaeffer, Yvan Avenas, A. Bricard, 2002, 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289).

Apport de la microthermie pour le refroidissement des systèmes

C. Schaeffer, Yvan Avenas, C. Schaeffer, 2003 .

CAD for hybrid power modules

E. Clavel, C. Schaeffer, Y. Marechal, 1993, Conference Record of the 1993 IEEE Industry Applications Conference Twenty-Eighth IAS Annual Meeting.

Silicon heat pipes used as thermal spreaders

Yvan Avenas, N. Cezac, C. Schaeffer, 2003 .

Thermal and electrical ageing of DBC substrates

S. Catellani, J.C. Crebier, C. Schaeffer, 2001, 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230).

Silicon heat pipes used as thermal spreaders

Yvan Avenas, N. Cezac, C. Schaeffer, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).