A. Bahr

3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications

Seung Wook Yoon, Flynn Carson, A. Bahr, 2009, 2009 11th Electronics Packaging Technology Conference.

Analysis of nonlinear microwave circuits using the compression approach

Ingo Wolff, M. Rittweger, J. Kunisch, 1993, 1993 IEEE MTT-S International Microwave Symposium Digest.

Multi-mode FDTD simulations of indoor propagation including antenna properties

J. Kunisch, J. Pamp, A. Bahr, 1995, 1995 IEEE 45th Vehicular Technology Conference. Countdown to the Wireless Twenty-First Century.

INTERFERECE OF ACTIVE MEDICAL IMPLANTS WITH GSM AND UMTS MOBILE PHONES AND BASE STATIONS

U. Gollor, A. Bahr, F. Gustrau, 2003 .