A. B. Lostetter

High Temperature (250 deg C) SiC Power Module for Military Hybrid Electrical Vehicle Applications

B. McPherson, John P. Kajs, Scott G. Castagno, 2011 .

Multilayer interconnects for a high power packaging strategy

Fred Barlow, A. Elshabini, A. B. Lostetter, 1998 .

An overview to integrated power module design for high power electronics packaging

Fred Barlow, A. Elshabini, A. B. Lostetter, 2000 .

The utilization of polymer thick film (PTF) and flex technologies for low cost Power electronics packaging of DC/DC down converters

Fred Barlow, A. Elshabini, A. B. Lostetter, 1999 .

A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications

Bret Whitaker, Adam Barkley, Zach Cole, 2013 .

Polymer thick film (PTF) and flex technologies for low cost power electronics packaging

Simon S. Ang, Fred Barlow, A. Elshabini, 2000, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426).