Woon-Seong Kwon

发表

Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology

J. Y. Lai, Suresh Ramalingam, Steve Chiu, 2015 .

Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)

Xin Wu, Suresh Ramalingam, Steve Chiu, 2014 .

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Suk-Jin Ham, Woon-Seong Kwon, Soon-Bok Lee, 2005 .

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Suresh Ramalingam, Steve Chiu, Liam Madden, 2013 .

Chip warpage model for reliability prediction of delamination failures

Woon-Seong Kwon, Soon-Bok Lee, Se Young Yang, 2012, Microelectron. Reliab..

Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Kyung-Wook Paik, Woon-Seong Kwon, Suk-Jin Ham, 2006, Microelectron. Reliab..

3D Integration in VLSI Circuits Implementation Technologies and Applications

Suresh Ramalingam, Liam Madden, Xin Wu, 2019 .

Mechanical Reliability and Bump Degradation of ACF Flip Chip Packages Using BCB (Cyclotene™) Bumping Dielectrics Under Temperature Cycling

Woon-Seong Kwon, Kyung-Wook Paik, Se-Young Jang, 2004 .

Microwave Frequency Model of FPBGA Solder Ball Extracted from S-Parameters Measurement

Seungyoung Ahn, Jun Ho Lee, Joungho Kim, 2004 .

Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications

Woon-Seong Kwon, Kyung-Wook Paik, Kijoong Kim, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2005 .

Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2004 .

Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Woon-Seong Kwon, Kyung-Wook Paik, K. Paik, 2004 .

High reliable non-conductive adhesives for flip chip CSP applications

Kyung-Woon Jang, Jin-Sang Hwang, Woon-Seong Kwon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

High current induced failure of ACAs flip chip joint

Woon-Seong Kwon, Kyung-Wook Paik, K. Paik, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

Woon-Seong Kwon, Kyung-Wook Paik, K. Paik, 2004 .

Highly reliable non-conductive adhesives for flip chip CSP applications

Jin-Sang Hwang, Woon-Seong Kwon, Kyung-Wook Paik, 2003 .