Terren Lu

Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology

J. Y. Lai, Suresh Ramalingam, Steve Chiu, 2015 .

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Suresh Ramalingam, Steve Chiu, Liam Madden, 2013 .

Warpage Study of Large 2.5D IC Chip Module

Sam Peng, Hung-Yuan Li, Terren Lu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Silicon Interposer Warpage Study for 2.5D IC without TSV Utilizing Glass Carrier CTE and Passivation Thickness Tuning

Hung-Yuan Li, Terren Lu, Chieh-Lung Lai, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).