Ara Philipossian

发表

Performance of a Novel Slurry Injection System on an Ebara F-REX200 Polisher for a Silicon Dioxide CMP Application

Yun Zhuang, Leonard Borucki, Yasa Sampurno, 2012 .

The IMEC Clean Concept : An Advanced Wafer Cleaning Technology

Marc Heyns, Marc Meuris, Ara Philipossian, 1994 .

Pattern evolution studies in STI CMP via real-time shear and down force spectral analyses

Yun Zhuang, Yasa Sampurno, Ara Philipossian, 2008 .

Characterizing recycled fumed silica slurries in ILD CMP applications

Paul Lefevre, Farhang Shadman, Patrick Levy, 2005, MICRO 2005.

Materials Research Society Symposium Proceedings: Preface

Duane S. Boning, Johann W. Bartha, Ara Philipossian, 2004 .

Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP

Ara Philipossian, L. Borucki, L. Borucki, 2004 .

Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

Yun Zhuang, Yasa Sampurno, Ara Philipossian, 2016 .

Effect of Tool Kinematics, Brush Pressure and Cleaning Fluid pH on Coefficient of Friction and Tribology of post-CMP PVA Brush Scrubbing Processes

Ara Philipossian, Lateef Mustapha, 2003 .

Effect of process temperature on coefficient of friction during CMP

Ara Philipossian, Dale L. Hetherington, J. Sorooshian, 2004 .

End-Point Detection of Ta/TaN Chemical Mechanical Planarization via Forces Analysis

Tadahiro Ohmi, Akinobu Teramoto, Yun Zhuang, 2010 .

Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

Ara Philipossian, Scott Olsen, 2003 .

Investigating Slurry Transport Beneath a Wafer during Chemical Mechanical Polishing Processes

Chris Rogers, Ara Philipossian, Livia Racz, 2000 .

Formation of Ultrathin Nitrided SiO2 Oxides by Direct Nitrogen Implantation into Silicon.

Ara Philipossian, Brian S. Doyle, Hamid R. Soleimani, 1995 .

The IMEC clean : A new concept for particle and metal removal on Si surfaces

Marc Heyns, Marc Meuris, Guy Vereecke, 1995 .

The Effect of Wafer Shape on Slurry Film Thickness and Friction Coefficients in Chemical Mechanical Planarization

Chris Rogers, Vincent P. Manno, Ara Philipossian, 2000 .

Arrhenius Characterization of ILD and Copper CMP Processes

Duane S. Boning, Farhang Shadman, Ara Philipossian, 2004 .

Determining the Effects of Slurry Surfactant, Abrasive Size, and Abrasive Content on the Tribology and Kinetics of Copper CMP

Ara Philipossian, P. Lefevre, A. Philipossian, 2003 .

Investigating techniques to improve gate-oxide integrity

Marc Heyns, Marc Meuris, Ara Philipossian, 1992 .

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

Yun Zhuang, Ara Philipossian, L. Borucki, 2010 .