Karsten Guth

Reliability aspects of copper metallization and interconnect technology for power devices

Daniel Bolowski, Karina Rott, Frank Umbach, 2016, Microelectron. Reliab..

End-of-life investigation on the .XT interconnect technology

Daniel Bolowski, Nicolas Heuck, Karsten Guth, 2015 .

New assembly and interconnects beyond sintering methods

Dirk Siepe, Frank Hille, Karsten Guth, 2010 .

Modeling and simulation of the ultrasonic wire bonding process

Walter Sextro, Simon Althoff, Tobias Meyer, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds

Walter Sextro, Simon Althoff, Daniel Bolowski, 2014 .

Improving the thermal reliability of large area solder joints in IGBT power modules

Peter Mahnke, Karsten Guth, 2006 .

Modeling of the stick-slip effect in heavy copper wire bonding to determine and reduce tool wear

Walter Sextro, Simon Althoff, Tobias Meyer, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling

M. Thoben, Nicolas Heuck, Karsten Guth, 2014 .