Po-Wen Hwang

Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing

Hsien-Chie Cheng, Wen-Hwa Chen, Tzu-Chin Huang, 2016, Microelectron. Reliab..

Development of an athermalized optomechanical system of large aperture remote sensing instruments

Ting-Ming Huang, Chia-Yen Chan, Po-Wen Hwang, 2017, Optical Engineering + Applications.

Numerical visualization and residence time determination of turbulent reacting duct flow with mass bleed and a backstep on one wall

Po-Wen Hwang, Tong-Miin Liou, 1998 .

Heat Conduction in Dissimilar Anisotropic Media with Bonding Defects/Interface Cracks

Yui-Chuin Shiah, Po-Wen Hwang, Y. Shiah, 2005 .

Large-eddy simulations of turbulent reacting flows in a chamber with gaseous ethylene injecting through the porous wall

Po-Wen Hwang, T. Liou, Tong-Miin Liou, 1994 .

Electromagnetic shielding effectiveness and functions of stainless steel/bamboo charcoal conductive fabrics

Jia-Horng Lin, Ching-Wen Lou, Po-Wen Hwang, 2014 .

CFD-based thermal characterization of board-level microelectronic devices under natural convection cooling

Hsien-Chie Cheng, Jiunn Fang, Po-Wen Hwang, 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.