Ding Mian Zhi

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, C. T. Chong, Chai Tai Chong, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

David Ho, Vempati Srinivasa Rao, C. T. Chong, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging

Vivek Chidambaram, Ding Mian Zhi, Bu Lin, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).