Daniel Ismael

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Vempati Srinivasa Rao, C. T. Chong, Chai Tai Chong, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

David Ho, Vempati Srinivasa Rao, C. T. Chong, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Ling Xie, Daniel Ismael, Sunil Wickramanayaka, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).