Sevgin Oktay

发表

A conduction-cooled module for high-performance LSI devices

Sevgin Oktay, H. C. Kammerer, S. Oktay, 1982 .

Multi-fluid subdued boiling; theoretical analysis of multi-fluid interface bubbles

Sevgin Oktay, 1971 .

Heat Transfer in Electronic Packages

Wataru Nakayama, Robert E. Simons, Sevgin Oktay, 1997 .

Parametric study of temperature profiles in chips joined by controlled collapse techniques

Sevgin Oktay, 1969 .