Liyu Yang

Failure rate estimation of known failure mechanisms of electronic packages

Joseph B. Bernstein, Liyu Yang, J. Bernstein, 2009, Microelectron. Reliab..

Design for Reliability of Solid State Lighting Products

Liyu Yang, Xiantao Yan, Liyu Yang, 2013 .

The investigation of modified Norris-Landzberg acceleration models for reliability assessment of Ball Grid Array packages

Kuan-Jung Chung, Chia-Che Wu, Liyu Yang, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Reliability Study of High-Density EBGA Packages Using the Cu Metallized Silicon

J. Bernstein, Liyu Yang, 2008, IEEE Transactions on Components and Packaging Technologies.

Reliability improvement study of a build-up wire bonding EBGA package using eight-layer 0.13 /spl mu/m copper silicon technology

Liyu Yang, R. Peng, C. King, 2006, 56th Electronic Components and Technology Conference 2006.

Design‐for‐reliability implementation in microelectronics packaging development

Liyu Yang, Joseph B. Bernstein, Bin Qian, 2011 .