Hans Norström

High-temperature behaviour of capped Ag/Ta and Ag/TaN metal stacks

Jörgen Olsson, Shabnam Mardani, Hans Norström, 2014 .

A comparative study of the diffusion barrier properties of TiN and ZrN

Mikael Östling, Sören Berg, Hans Norström, 1986 .

Reactively sputtered ZrN used as an Al/Si diffusion barrier in a Zr contact to silicon

Mikael Östling, Sören Berg, Hans Norström, 1984 .

TiSi2/TiN–A Stable Multilayered Contact Structure for Shallow Implanted Junctions in VLSI Technology

Mikael Östling, Hans Norström, C. Petersson, 1983 .