A. Fenner

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

John H. Lau, Ying Ying Lim, K. Y. Au, 2009, 2009 59th Electronic Components and Technology Conference.

Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device

Ying Ying Lim, V. Kripesh, Andy Fenner, 2010, 2010 12th Electronics Packaging Technology Conference.

Process Development and Reliability of Microbumps

Vempati Srinivasa Rao, Vaidyanathan Kripesh, Andy Fenner, 2010, IEEE Transactions on Components and Packaging Technologies.