R. Erich

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

John H. Lau, Ying Ying Lim, K. Y. Au, 2009, 2009 59th Electronic Components and Technology Conference.

Shear testing and failure mode analysis for evaluation of BGA ball attachment

R. Erich, Richard J. Coyle, A. Primavera, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).