Hongbin Wu
发表
W. H. Siew,
Qingquan Li,
Hongshun Liu,
2022,
IEEE Transactions on Dielectrics and Electrical Insulation.
Qingquan Li,
Hongshun Liu,
Kaining Hou,
2022,
IEEE Transactions on Dielectrics and Electrical Insulation.
Pingping Han,
Wei Yang,
Yan Wang,
2022,
IEEE Transactions on Power Delivery.