S.W.R. Lee

Development of 2D Modeling Techniques for the Thermal Fatigue Analysis of Solder Joints of a Module Mounted in a 3D Cavity on a Printed Circuit Board

Yuming Ye, Y.S. Chan, S.W.R. Lee, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

D. Lau, S.W.R. Lee, Sang Liu, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Investigation of the Effect of PCB Base Materials and Pad Surface Finish on the Thermal Fatigue Life of Lead-free Solder Joints of PBGA and Passive Resistors

M. Osterman, M. Pecht, S.W.R. Lee, 2006, 2006 International Conference on Electronic Materials and Packaging.

Development and prototyping of a HB-LED array module for indoor solid state lighting

S.P. Chan, K.H. Lee, S.W.R. Lee, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing

S.W.R. Lee, Y.K. Tsui, S. Lee, 2005, IEEE Transactions on Advanced Packaging.

Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis

Yuming Ye, D. Lau, Y.S. Chan, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Challenges in modeling of accelerated life testing ITHERM 2004 panel discussion

S.W.R. Lee, S. Sitaraman, D. X. Goyal, 2004 .