Jupyo Hong

Warpage control of wireless LAN SiP during manufacturing process

Sung Yi, Shan Gao, Seogmoon Choi, 2007, 2007 International Conference on Electronic Materials and Packaging.

Development of an Ultra-Slim System in Package (SiP)

Jinsu Kim, Shan Gao, Seogmoon Choi, 2008 .

Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package

Sung Yi, Shan Gao, Seogmoon Choi, 2008, 2008 58th Electronic Components and Technology Conference.

Parametric design study for minimized warpage of WL-CSP

Sung Yi, Shan Gao, Seogmoon Choi, 2008, 2008 2nd Electronics System-Integration Technology Conference.