Min Woo Daniel Rhee

Flow modeling of die attach process and the optimization of process parameters in advance packaging

Lin Ji, Leong Ching Wai, Min Woo Daniel Rhee, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages

Vempati Srinivasa Rao, Min Woo Daniel Rhee, Yen Yi Germaine Hoe, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Impact of advanced materials on power cycling performance and process dependent stresses of QFN

Min Woo Daniel Rhee, Germaine Hoe Yen Yi, Eva Wai Leong Ching, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Process characterization of highly conductive silver paste die attach materials for thin die on QFN

Min Woo Daniel Rhee, V. S. Rao, L. C. Wai, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).