X.R. Zhang

Interfacial fracture toughness test methodology for flip chip underfill encapsulant

Z. P. Wang, X. Shi, X.Q. Shi, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Modeling interface fracture in flip chip assembly

X.Q. Shi, H. Pang, Z.P. Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

In-situ micro-digital image speckle correlation technique for characterization of materials' properties and verification of numerical models

H.L.J. Pang, Xunqing Shi, X.R. Zhang, 2004, IEEE Transactions on Components and Packaging Technologies.

On the moduli of viscoelastic materials

J. Pang, X.Q. Shi, X.R. Zhang, 2002, 4th Electronics Packaging Technology Conference, 2002..