H. Kurata

Point focusing x‐ray camera and the study of total external reflection

H. Kurata, 1982 .

Wafer Process Chip Size Package Consisting of Double-Bump Structure for Small-Pin-Count Packages

M. Takahashi, H. Kurata, J. Furukawa, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..